BYD1100 Datasheet, PDF (2/12 Pages) NXP Semiconductors – Hyper fast soft-recovery rectifier

Philips Semiconductors
Hyper fast soft-recovery rectifier
Product specification
BYD1100
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Smallest surface mount rectifier
outline
• Shipped in 8 mm embossed tape.
DESCRIPTION
Cavity free cylindrical glass package
through Implotec™⁽¹⁾ technology.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
(1) Implotec is a trademark of Philips.
handbook, 4 columns
k
a
MAM061
Fig.1 Simplified outline (SOD87) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
V_RRM
V_R
I_F(AV)
repetitive peak reverse voltage
continuous reverse voltage
average forward current
I_FRM
repetitive peak forward current
I_FSM
non-repetitive peak forward current
T_stg
storage temperature
T_j
junction temperature
CONDITIONS
T_tp = 55 °C; averaged over any
20 ms period; see Figs.2 and 4
T_tp = 110 °C; averaged over any
20 ms period; see Figs.2 and 4
T_amb = 60 °C; printed-circuit board
mounting, see Fig.12;
averaged over any 20 ms period;
see Figs.3 and 4
T_tp = 105 °C; see Fig.6
T_amb = 60 °C; see Fig.7
t = 10 ms half sine wave; T_j = T_{j max}
prior to surge; V_R = V_RRMmax
MIN.
−
−
−
−
−
−
−
−
−65
−65
MAX.
100
100
2.7
UNIT
V
V
A
1.7 A
0.85 A
16 A
8A
15 A
+175 °C
+175 °C
1999 Nov 16
2