BY614 Datasheet, PDF (2/6 Pages) NXP Semiconductors – Miniature high-voltage soft-recovery rectifier

Philips Semiconductors
Miniature high-voltage soft-recovery
rectifier
Product specification
BY614
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Soft-recovery switching
characteristics
• Very compact construction.
APPLICATIONS
• Miniature high-voltage assemblies
such as voltage multipliers.
DESCRIPTION
Miniature glass package, using a high
temperature alloyed construction.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
The package is designed to be used
in an insulating medium such as
resin, oil or SF6 gas.
handbook, halfp^kage
a
MAM162
The cathode lead is marked with a black band.
Fig.1 Simplified outline (SOD61H2) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
V_RSM
V_RRM
V_RW
V_R
I_F(AV)
I_FRM
I_FSM
T_stg
T_j
non-repetitive peak reverse voltage
repetitive peak reverse voltage
working reverse voltage
continuous reverse voltage
average forward current
repetitive peak forward current
non-repetitive peak forward current
storage temperature
junction temperature
averaged over any 20 ms period;
PCB mounting (see Fig.5);
T_amb = 65 °C; see Fig.2;
see also Fig.3
t ≤ 10 ms; half sinewave;
T_j = T_{j max} prior to surge;
V_R = V_RWmax
MIN.
−
−
−
−
−
MAX.
2 200
2 200
2 000
2 000
50
UNIT
V
V
V
V
mA
−
500 mA
−
1A
−65
+150 °C
−65
+150 °C
1996 Sep 26
2