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BU2508DW Datasheet, PDF (2/7 Pages) NXP Semiconductors – Silicon Diffused Power Transistor
Philips Semiconductors
Silicon Diffused Power Transistor
Product specification
BU2508DW
STATIC CHARACTERISTICS
Tmb = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
ICES
Collector cut-off current 2
ICES
IEBO
BVEBO
Rbe
VCEOsust
Emitter cut-off current
Emitter-base breakdown voltage
Base-emitter resistance
Collector-emitter sustaining voltage
VCEsat
VBEsat
hFE
hFE
VF
Collector-emitter saturation voltage
Base-emitter saturation voltage
DC current gain
Diode forward voltage
CONDITIONS
VBE = 0 V; VCE = VCESMmax
VBE = 0 V; VCE = VCESMmax;
Tj = 125 ˚C
VEB = 7.5 V; IC = 0 A
IB = 600 mA
VEB = 7.5 V
IB = 0 A; IC = 100 mA;
L = 25 mH
IC = 4.5 A; IB = 1.12 A
IC = 4.5 A; IB = 1.7 A
IC = 1 A; VCE = 5 V
IC = 4.5 A; VCE = 1 V
IF = 4.5 A
MIN.
-
-
140
7.5
-
700
-
-
-
4
-
TYP. MAX. UNIT
-
1.0 mA
-
2.0 mA
-
390 mA
13.5 -
V
33
-
Ω
-
-
V
-
1.0
V
-
1.1
V
13
-
5.5 7.0
1.6 2.0
V
DYNAMIC CHARACTERISTICS
Tmb = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
Cc
Collector capacitance
Switching times (16 kHz line
deflection circuit)
ts
Turn-off storage time
tf
Turn-off fall time
Switching times (38 kHz line
deflection circuit)
ts
Turn-off storage time
tf
Turn-off fall time
CONDITIONS
IE = 0 A; VCB = 10 V; f = 1 MHz
ICsat = 4.5 A; IB(end) = 1.1 A; LB = 6 µH;
-VBB = 4 V; (-dIB/dt = 0.6 A/µs)
ICsat = 4.0 A; IB(end) = 0.9 A; LB = 6 µH;
-VBB = 4 V; (-dIB/dt = 0.6 A/µs)
TYP. MAX. UNIT
80
-
pF
5.0 6.0 µs
0.4 0.6 µs
4.7 5.7 µs
0.25 0.35 µs
TRANSISTOR
IC
DIODE
ICsat
t
IB
VCE
20us
26us
64us
IBend
t
t
Fig.1. Switching times waveforms.
ICsat
90 %
IC
ts
IB
IBend
10 %
tf
t
t
- IBM
Fig.2. Switching times definitions.
2 Measured with half sine-wave voltage (curve tracer).
September 1997
2
Rev 1.100