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BTA216 Datasheet, PDF (2/4 Pages) NXP Semiconductors – Three quadrant triacs guaranteed commutation
Philips Semiconductors
Three quadrant triacs
guaranteed commutation
Objective specification
BTA216 series D, E and F
THERMAL RESISTANCES
SYMBOL PARAMETER
CONDITIONS
Rth j-mb
Rth j-a
Thermal resistance
full cycle
junction to mounting base half cycle
Thermal resistance
in free air
junction to ambient
MIN.
-
-
-
TYP.
-
-
60
MAX.
1.2
1.7
-
UNIT
K/W
K/W
K/W
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER
IGT
Gate trigger current2
IL
Latching current
CONDITIONS
MIN. TYP.
MAX.
UNIT
BTA216-
...D ...E ...F
VD = 12 V; IT = 0.1 A
T2+ G+
T2+ G-
T2- G-
VD = 12 V; IGT = 0.1 A
T2+ G+
T2+ G-
T2- G-
-
-
5
10 25 mA
-
-
5
10 25 mA
-
-
5
10 25 mA
-
-
15 20 25 mA
-
-
25 30 40 mA
-
-
25 30 40 mA
IH
Holding current
VD = 12 V; IGT = 0.1 A
-
-
15 25 30 mA
VT
On-state voltage
IT = 20 A
-
1.2
1.5
V
VGT
Gate trigger voltage
VD = 12 V; IT = 0.1 A
-
0.7
1.5
V
VD = 400 V; IT = 0.1 A;
0.25 0.4
-
V
Tj = 125 ˚C
ID
Off-state leakage current VD = VDRM(max);
-
0.1
0.5
mA
Tj = 125 ˚C
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
BTA216- ...D ...E ...F
dVD/dt
Critical rate of rise of
off-state voltage
VDM = 67% VDRM(max);
30 60 70
-
Tj = 110 ˚C; exponential
waveform; gate open
circuit
dIcom/dt Critical rate of change of VDM = 400 V; Tj = 110 ˚C; 1.8 3.5 4.5
-
commutating current
IT(RMS) = 16 A;
dVcom/dt = 20v/µs; gate
open circuit
- V/µs
- A/ms
dIcom/dt Critical rate of change of VDM = 400 V; Tj = 110 ˚C; 4.3 5.3 6.3
-
commutating current
IT(RMS) = 16 A;
dVcom/dt = 0.1v/µs; gate
open circuit
- A/ms
tgt
Gate controlled turn-on ITM = 20 A; VD = VDRM(max); -
-
-
2
-
µs
time
IG = 0.1 A; dIG/dt = 5 A/µs
2 Device does not trigger in the T2-, G+ quadrant.
October 1999
2
Rev 1.100