74HC244_05 Datasheet, PDF (2/22 Pages) NXP Semiconductors – Octal buffer/line driver; 3-state

Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
f_i = input frequency in MHz;
f_o = output frequency in MHz;
C_L = output load capacitance in pF;
V_CC = supply voltage in V;
N = number of inputs switching;
∑(C_L × V_CC2 × f_o) = sum of outputs.
4. Ordering information
Table 2: Ordering information
Type number Package
Temperature range Name
Description
74HC244
74HC244N −40 °C to +125 °C DIP20
plastic dual in-line package; 20 leads (300 mil)
74HC244D −40 °C to +125 °C SO20
plastic small outline package; 20 leads;
body width 7.5 mm
74HC244DB −40 °C to +125 °C SSOP20
plastic shrink small outline package; 20 leads;
body width 5.3 mm
74HC244PW −40 °C to +125 °C TSSOP20 plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
74HC244BQ −40 °C to +125 °C
DHVQFN20 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5 × 4.5 × 0.85 mm
74HCT244
74HCT244N −40 °C to +125 °C DIP20
plastic dual in-line package; 20 leads (300 mil)
74HCT244D −40 °C to +125 °C SO20
plastic small outline package; 20 leads;
body width 7.5 mm
74HCT244DB −40 °C to +125 °C SSOP20
plastic shrink small outline package; 20 leads;
body width 5.3 mm
74HCT244PW −40 °C to +125 °C TSSOP20 plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
74HCT244BQ −40 °C to +125 °C
DHVQFN20 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5 × 4.5 × 0.85 mm
Version
SOT146-1
SOT163-1
SOT339-1
SOT360-1
SOT764-1
SOT146-1
SOT163-1
SOT339-1
SOT360-1
SOT764-1
74HC_HCT244_3
Product data sheet
Rev. 03 — 22 December 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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