SA56202 Datasheet, PDF (18/24 Pages) NXP Semiconductors – One-chip motor driver

Philips Semiconductors
12. Package outline
SA56202
One-chip motor driver
HTSSOP56: plastic thermal enhanced thin shrink small outline package; 56 leads;
body width 6.1 mm; exposed die pad
SOT793-1
y
Z
56
D
exposed die pad
Dh
pin 1 index
1
e
E
A
X
c
HE
vM A
29
A ^A2
Eh
A1
28
wM
bp
detail X
(A ₃₎
θ
Lp
L
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D ⁽¹⁾ D_h E ⁽²⁾ E_h
e
H_E
L
L_p
v
w
y
Z ⁽¹⁾
θ
mm
1.2
0.15
0.05
1.05
0.80
0.25
0.27
0.17
0.20
0.09
14.1
13.9
4.3
4.1
6.2
6.0
4.3
4.1
0.5
8.3
7.9
1
0.8
0.4
0.2 0.08 0.1
0.4
0.1
8^o
0^o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
SOT793-1
143E36T
MO-153
03-03-04
Fig 14. Package outline.
9397 750 12772
Preliminary data sheet
Rev. 01 — 19 July 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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