BAS40_15 Datasheet, PDF (18/22 Pages) SeCoS Halbleitertechnologie GmbH – Surface Mount Schottky Barrier Diodes

NXP Semiconductors
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
2.2
0.6
1.1
0.7
2.0 0.85
2
3
1
Dimensions in mm
0.6
(3x)
1.9
solder lands
solder resist
Fig 28. Reflow soldering footprint SOT416
1.5
0.5
(3x)
msa438
solder paste
occupied area
2.75
2.45
2.1
1.6
0.538
2 1.7 1.075
0.55
(2×)
0.4
(6×) ^{0.25 0.3}
(2×) (2×)
1.7
0.45
0.6
(4×)
(2×)
0.5
0.65
(4×)
(2×)
0.325 0.375
(4×) (4×)
Reflow soldering is the only recommended soldering method.
Fig 29. Reflow soldering footprint SOT666
solder lands
placement area
solder paste
occupied area
Dimensions in mm
sot666_fr
BAS40_1PSXXSB4X_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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