74HC_HCT245_15 Datasheet, PDF (15/22 Pages) NXP Semiconductors – Octal bus tranceiver; 3-state

Philips Semiconductors
13. Package outline
DIP20: plastic dual in-line package; 20 leads (300 mil)
74HC245; 74HCT245
Octal bus tranceiver; 3-state
SOT146-1
D
L
Z
20
e
b
pin 1 index
1
A_{2 A}
A₁
wM
b₁
11
M_E
c
(e ₁)
M_H
E
10
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
c
D ⁽¹⁾
E ⁽¹⁾
e
e₁
L
M_E
M_H
w
Z ⁽¹⁾
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
0.36 26.92 6.40
0.23 26.54 6.22
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2
inches 0.17
0.02
0.13
0.068 0.021 0.014 1.060
0.051 0.015 0.009 1.045
0.25
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.078
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
IEC
SOT146-1
REFERENCES
JEDEC
JEITA
MS-001
SC-603
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 8. Package outline SOT146-1 (DIP20)
9397 750 14502
Product data sheet
Rev. 03 — 31 January 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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