TDA4865J Datasheet, PDF (14/18 Pages) NXP Semiconductors – eflection boosters for use in vertical deflection systems for frame frequencies up to 200 Hz.

NXP Semiconductors
TDA4865J; TDA4865AJ
Vertical deflection booster
13. Package outline
DBS7P: plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad
SOT524-1
non-concave
x
q1
Eh
D
D1
P
k
q2
Dh
view B: mounting base side
A2
E
B
q
L3
L2
L
L1
1
7
Z
e1
wM
Q
c
vM
e
bp
0
5
10 mm
m
e2
DIMENSIONS (mm are the original dimensions)
scale
UNIT A2⁽²⁾ bp c D⁽¹⁾ D1⁽²⁾ Dh E⁽¹⁾ Eh e e1 e2 k L L1 L2 L3 m P Q q q1 q2 v w x Z⁽¹⁾
mm
2.7 0.80 0.58 13.2 6.2
2.3 0.65 0.48 12.8 5.8
3.5
14.7
14.3
3.5
2.54 1.27 5.08
3
2
12.4 11.4
11.0 10.0
6.7
5.5
4.5
3.7
2.8
3.4 1.15 17.5 _4.85 3.8
3.1 0.85 16.3
3.6
0.8
0.3
0.02
2.92
2.37
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT524-1
EUROPEAN
PROJECTION
ISSUE DATE
00-07-03
03-03-12
Fig 12. Package outline SOT524-1 (DBS7P)
TDA4865J_TDA4865AJ_2
Product data sheet
Rev. 02 — 3 November 2006
© NXP B.V. 2006. All rights reserved.
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