TDA4865J Datasheet, PDF (10/18 Pages) NXP Semiconductors – eflection boosters for use in vertical deflection systems for frame frequencies up to 200 Hz.

NXP Semiconductors
TDA4865J; TDA4865AJ
Vertical deflection booster
THERMAL
PROTECTION
TDA4865AJ
DIFFERENTIAL
INPUT
STAGE
VERTICAL
OUTPUT
FLYBACK
GENERATOR
REFERENCE
CIRCUIT
7
6
INP INN
5
4
3
2
VOUT
GND V_P2
V_P3
from
deflection controller
R3
1.8 kΩ
R2
1.8 kΩ
RS1 ^CS1
CS2(1)
RS2
5.6 Ω
RP
270 Ω
5.6 Ω 100
nF
deflection
coil
CF
100 µF
R5 ⁽²⁾
240 Ω (2 W)
470 µF
R1
0.5 Ω
(1 W)
V_N
−12.5 V
1
V_P1
D1
BYV27
470 µF
3.9 Ω
(2 W)
R6 ⁽³⁾
V_P
+12.5 V
001aad304
Remark: the heat sink of the IC must be isolated against ground of the application (it is connected to pin GND).
(1) With C_S2 (typical value between 47 nF and 150 nF) the flyback time and the noise behavior can be optimized.
(2) With R5 capacitor C_F will be charged during scan and the value (typical value between 150 Ω and 270 Ω) depends on I_defl,
t_flb and C_F.
(3) R6 reduces the power dissipation of the IC. The maximum possible value depends on the application.
Fig 8. Application diagram with TDA4865AJ
12.1 Example for both TDA4865J and TDA4865AJ
Table 8. Values given from application
Symbol
Value
I_{defl(max)(M)}
L_deflcoil
R_deflcoil
R_P
R1
1.6 (peak value)
10
4
270
0.5
R2
1.8
R3
1.8
V_F[1]
50
T_amb
50
T_deflcoil
75
R_th(j-mb)
4
R_th(mb-h)
0.5
R_th(h-a)
2
[1] Flyback voltage measured against 0 V; for TDA4865J only.
Unit
A
mH
Ω
Ω
Ω
kΩ
kΩ
V
°C
°C
K/W
K/W
K/W
TDA4865J_TDA4865AJ_2
Product data sheet
Rev. 02 — 3 November 2006
© NXP B.V. 2006. All rights reserved.
10 of 18