PZ3064 Datasheet, PDF (13/20 Pages) NXP Semiconductors – 64 macrocell CPLD

Philips Semiconductors
64 macrocell CPLD
Product specification
PZ3064
Package Thermal Characteristics
Philips Semiconductors uses the Temperature Sensitive Parameter
(TSP) method to test thermal resistance. This method meets
Mil-Std-883C Method 1012.1 and is described in Philips 1995 IC
Package Databook. Thermal resistance varies slightly as a function
of input power. As input power increases, thermal resistance
changes approximately 5% for a 100% change in power.
Figure 7 is a derating curve for the change in Θ_JA with airflow based
on wind tunnel measurements. It should be noted that the wind flow
dynamics are more complex and turbulent in actual applications
than in a wind tunnel. Also, the test boards used in the wind tunnel
contribute significantly to forced convection heat transfer, and may
not be similar to the actual circuit board, especially in size.
Package
44-pin PLCC
44-pin TQFP
68-pin PLCC
84-pin PLCC
100-pin PQFP
Θ_JA
44.8°C/W
60.8°C/W
44.9°C/W
34.7°C/W
44.5°C/W
PERCENTAGE ⁰
REDUCTION IN
Θ_JA (%)
10
20
30
40
50
0
PLCC/
QFP
1
2
3
4
5
AIR FLOW (m/s)
SP00419A
Figure 7. Average Effect of Airflow on Θ_JA
1997 Mar 05
93