GTL2014 Datasheet, PDF(13/15 Page) NXP Semiconductors

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GTL2014 Datasheet, PDF (13/15 Pages) NXP Semiconductors – 4-bit LVTTL to GTL transceiver

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Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45Â° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deï¬nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deï¬nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ï¬ex foil. However, the image sensor package can be mounted by the client on a ï¬ex foil by

using a hot bar soldering process. The appropriate soldering proï¬le can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

15. Abbreviations

Table 11: Abbreviations

Acronym

Description

CDM

Charged Device Model

CMOS

Complementary Metal Oxide Silicon

ESD

ElectroStatic Discharge

GTL

Gunning Transceiver Logic

HBM

Human Body Model

LVTTL

Low Voltage Transistor-Transistor Logic

Machine Model

PRR

Pulse Rate Repetition

TTL

Transistor-Transistor Logic

16. Revision history

Table 12: Revision history

Document ID

Release date

GTL2014_1

20050519

Data sheet status

Product data sheet

Change notice Doc. number Supersedes

9397 750 13534 -

9397 750 13534

Product data sheet

Rev. 01 â 19 May 2005

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