TDA8575 Datasheet, PDF (12/16 Pages) NXP Semiconductors – Ground noise isolation amplifier

Philips Semiconductors
Ground noise isolation amplifier
PACKAGE OUTLINES
SO16: plastic small outline package; 16 leads; body width 3.9 mm
Preliminary specification
TDA8575
SOT109-1
D
y
Z
16
pin 1 index
1
e
E
A
X
c
H_E
vM A
9
A₂
A₁
8
b_p
wM
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT _max. A₁
A₂
A₃
b_p
c
D ⁽¹⁾ E ⁽¹⁾
e
H_E
L
L_p
Q
v
w
y
Z ⁽¹⁾
θ
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25 0.25
0.1
0.7
0.3
8^o
inches
0.069
0.0098
0.0039
0.057
0.049
0.01
0.019 0.0098 0.39
0.014 0.0075 0.38
0.16
0.15
0.050
0.24
0.23
0.041
0.039
0.016
0.028
0.020
0.01
0.01
0.004
0.028
0.012
0^o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT109-1
IEC
076E07S
REFERENCES
JEDEC
EIAJ
MS-012AC
EUROPEAN
PROJECTION
ISSUE DATE
91-08-13
95-01-23
1996 Jul 29
12