TDA4866 Datasheet, PDF (12/16 Pages) NXP Semiconductors – Full bridge current driven vertical deflection booster

Philips Semiconductors
Full bridge current driven vertical deflection
booster
PACKAGE OUTLINE
SIL9P: plastic single in-line power package; 9 leads
non-concave
x
D
Eh
Product specification
TDA4866
SOT131-2
Dh
view B: mounting base side
d
A2
B
j
E
A₁
b
L
1
Z
e
9
wM
b_p
0
5
scale
10 mm
c
Q
DIMENSIONS (mm are the original dimensions)
UNIT
A₁
max.
A₂
b
max.
b_p
c
D⁽¹⁾
d
D_h
E ⁽¹⁾
e
E_h
mm 2.0
4.6
4.2
1.1
0.75 0.48
0.60 0.38
24.0 20.0
23.6 19.6
10
12.2
11.8
2.54
6
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT131-2
REFERENCES
JEDEC
EIAJ
j
L
Q
w
x
Z ⁽¹⁾
3.4
3.1
17.2
16.5
2.1
1.8
0.25
0.03
2.00
1.45
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-03-11
1999 Jun 14
12