TDA4800 Datasheet, PDF (12/16 Pages) NXP Semiconductors – Vertical deflection circuit for monitor applications

Philips Semiconductors
Vertical deflection circuit for monitor
applications
MOUNTING INSTRUCTIONS FOR
13-LEAD DBS13P POWER
PACKAGE
The rise in temperature caused by
power dissipation in the circuit is
reduced by adding a heatsink with a
sufficiently low thermal resistance:
R_th(mb-h) + R_th(h-a) = R_th(mb-a)
(e.g. the heatsink of Fig.5). It is
possible to attach the package to the
heatsink by screws (Fig.6) or by a
compression spring (Fig.7). A layer of
silicon grease between the heatsink
and the mounting base optimizes
thermal contact.
86
18.5
10.5
27
3.5
27
3.5
Product specification
TDA4800
50
1.5
10
5
22.5
63.5
M2.5
(2x)
MHA585
Dimensions in mm.
Fig.5 Heatsink made of black-leaded Aluminium.
page
,, ^heatsink
,,,,,,,,,,,,,,,, ^PCboard
MHA586
Fig.6 Package and heatsink
attached by screws.
1997 Mar 27
handbook, halfpage
27
6
22
0.4
8.5
4.5
12
30°
MHA587
Dimensions in mm.
Fig.7 Compression spring for easily attaching the package to the
heatsink of Fig.5.
12