SSL21081AT Datasheet, PDF (12/22 Pages) NXP Semiconductors – Compact non-dimmable LED driver IC

NXP Semiconductors
SSL21082AT
Mains dimmable LED driver IC
8.8 Heat sink
In SSL21082AT applications, the PCB copper acts as the heat sink. The IC has thermal
leads (GND pins 2, 6, 10 and 11) for enhanced heat transfer from die to the PCB copper
heat sink. The thermal lead connection can drastically reduce thermal resistance.
Equation 1 shows the relationship between the maximum allowable power dissipation and
the thermal resistance from junction to ambient.
R_{thj – a}
=
_---T_{---j----m---a---x-----}–_-----T_{---a---m----b--}_-
P
(1)
Where:
R_th(j-a) = thermal resistance from junction to ambient
T_j(max) = maximum junction temperature
T_amb = ambient temperature
P = Power dissipation
SSL21082AT
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 October 2013
© NXP B.V. 2013. All rights reserved.
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