BUK7506-55B Datasheet, PDF (12/15 Pages) NXP Semiconductors – TrenchMOS standard level FET

Philips Semiconductors
7. Soldering
handbook, full pagewidth
1.50
2.25 2.15
8.15 8.35
1.50
4.60
0.30
4.85
7.95
3.00
solder lands
solder resist
occupied area
solder paste
Dimensions in mm.
Fig 18. Reflow soldering footprint for SOT404.
BUK75/7606-55B
TrenchMOS™ standard level FET
10.85
10.60
10.50
7.50
7.40
1.70
8.275
5.40
8.075
0.20
5.08
1.20
1.30
1.55
MSD057
9397 750 11132
Product data
Rev. 01 — 31 March 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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