BLF888B_15 Datasheet, PDF (12/17 Pages) NXP Semiconductors – UHF power LDMOS transistor

NXP Semiconductors
9. Package outline
Flanged balanced ceramic package; 2 mounting holes; 4 leads
BLF888B; BLF888BS
UHF power LDMOS transistor
SOT539A
A
H U2
L
A
D
F
D1
U1
B
q
C
H1
w2 _{M C M}
c
1
2
p
E1
E
5
w1 M _A M _B M
3
4
b
w3 _M
Q
e
0
5 10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT A
bc
D D1 e
E
E1 F
H H1 L
pQ
q U1 U2 w1 w2 w3
mm
4.7
4.2
11.81
11.56
0.18
0.10
31.55
30.94
31.52
30.96
13.72
9.50
9.30
9.53
9.27
1.75 17.12 25.53 3.48
1.50 16.10 25.27 2.97
3.30
3.05
2.26
2.01
35.56
41.28
41.02
10.29
10.03
0.25
0.51
0.25
inches
0.185
0.165
0.465
0.455
0.007
0.004
1.242
1.218
1.241
1.219
0.540
0.374
0.366
0.375
0.365
0.069
0.059
0.674
0.634
1.005
0.995
0.137
0.117
0.130 0.089
0.120 0.079
1.400
1.625
1.615
0.405
0.395
0.010
0.020
0.010
Note
1. millimeter dimensions are derived from the original inch dimensions.
2. recommended screw pitch dimension of 1.52 inch (38.6 mm) based on M3 screw.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
SOT539A
10-02-02
12-05-02
Fig 13. Package outline SOT539A
BLF888B_BLF888BS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 July 2013
© NXP B.V. 2013. All rights reserved.
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