TDA8440 Datasheet, PDF (11/12 Pages) NXP Semiconductors – Switch for CTV receivers

Philips Semiconductors
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PACKAGE OUTLINE
DIP18: plastic dual in-line package; 18 leads (300 mil)
Product specification
TDA8440
SOT102-1
D
L
Z
e
18
pin 1 index
M_E
A_{2 A}
A₁
wM
b₁
b
b₂
10
c
(e ₁)
M_H
E
1
9
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
b₂
c
D ⁽¹⁾
E ⁽¹⁾
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
1.40 0.32
1.14 0.23
21.8 6.48
21.4 6.20
inches _0.19
0.020
0.15
0.055 0.021 0.055 0.013
0.044 0.015 0.044 0.009
0.86
0.84
0.26
0.24
e
2.54
0.10
e₁
7.62
0.30
L
3.9
3.4
0.15
0.13
M_E
8.25
7.80
0.32
0.31
M_H
9.5
8.3
0.37
0.33
w
Z ⁽¹⁾
max.
0.254 0.85
0.01 0.033
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT102-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
93-10-14
95-01-23
November 1985
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