PMV33UPE_15 Datasheet, PDF (11/15 Pages) NXP Semiconductors – 20 V, single P-channel Trench MOSFET

NXP Semiconductors
10. Soldering
3.3
2.9
1.9
PMV33UPE
20 V, single P-channel Trench MOSFET
3 1.7
2
0.7
0.6
(3×)
(3×)
0.5
(3×)
0.6
(3×)
1
Fig 19. Reflow soldering footprint for SOT23 (TO-236AB)
2.2
1.2
(2×)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot023_fr
1.4
(2×)
4.6 2.6
1.4
2.8
4.5
Fig 20. Wave soldering footprint for SOT23 (TO-236AB)
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
sot023_fw
PMV33UPE
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 June 2012
© NXP B.V. 2012. All rights reserved.
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