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BTA2008W-600D Datasheet, PDF (11/14 Pages) NXP Semiconductors – 3Q Hi-Com Triac | |||
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NXP Semiconductors
BTA2008W-600D
3Q Hi-Com Triac
11. Soldering
1.3 1.2
(4Ã) (4Ã)
7
3.85
3.6
3.5
0.3
4
3.9 6.1 7.65
1
2
3
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
2.3
2.3
1.2
(3Ã)
1.3
(3Ã)
6.15
Fig. 14. Reflow soldering footprint for SC-73 (SOT223)
8.9
6.7
1.9
4
1
2
3
2.7
2.7
1.1
1.9
(2Ã)
Fig. 15. Wave soldering footprint for SC-73 (SOT223)
6.2
8.7
1.9
(3Ã)
sot223_fr
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot223_fw
BTA2008W-600D
Product data sheet
All information provided in this document is subject to legal disclaimers.
14 August 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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