BGY925 Datasheet, PDF (10/12 Pages) NXP Semiconductors – UHF amplifier module

Philips Semiconductors
UHF amplifier module
Product specification
BGY925
PACKAGE OUTLINE
Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads
SOT365A
y
E
L
D
A
F
U
q
A
U2
p
U1
12
e
34
bp
wM
e1
e
Z
vA
c
Q
0
10
20 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A bp c
DE
e e1 F
Lp
Qq
U U1 U2 v w
y
Z
mm
9.5
9.0
0.56
0.46
0.3
0.2
30.1
29.9
18.6
18.4
2.54
17.78
3.25
3.15
6.5
6.1
4.1
3.9
4.0 40.74 48.0 15.4 7.75
3.8 40.54 48.4 15.2 7.55
0.3
0.25
0.1
12.8
12.6
OUTLINE
VERSION
IEC
SOT365A
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
99-02-06
2000 Feb 02
10