BCM847BV Datasheet, PDF (10/15 Pages) NXP Semiconductors – NPN/NPN matched double transistors

Philips Semiconductors
11. Soldering
BCM847BV/BS/DS
NPN/NPN matched double transistors
2.00
1.70
1.00
0.55
(2×)
2.75
2.45
2.10
1.60
0.15
(4×)
0.40
(6×)
0.30 (2×)
0.375
(4×)
0.075
solder lands
solder resist
1.20
2.20
2.50
placement area
occupied area
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Fig 14. Reflow soldering footprint SOT666
2.65
0.60
(2×)
2.35
solder lands
solder paste
0.50
(4×)
solder resist
occupied area
Dimensions in mm
0.50
(4×)
1.20
2.40
Fig 15. Reflow soldering footprint SOT363 (SC-88)
0.40
(2×)
0.90
2.10
sot363
BCM847BV_BS_DS_5
Product data sheet
Rev. 05 — 27 June 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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