L-S115GECT Datasheet, PDF (13/15 Pages) PARA LIGHT ELECTRONICS CO., LTD. – SURFACE MOUNT DEVICE LED

Release by
PARA LIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-S115GECT
4. Lead-Free Soldering
For Reflow Soldering :
1 Pre-Heat Temp : 150-180 ,120sec.Max.
2 Soldering Temp : Temperature Of Soldering Pot Over 230 ,40sec.Max.
3 Peak Temperature : 260 5sec.
4 Reflow Repetition : 2 Times Max.
5 Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
REV:A / 0
For Soldering Iron (Not Recommended) :
1 Iron Tip Temp : 350 Max.
2 Soldering Iron : 30w Max.
3 Soldering Time : 3 Sec. Max. One Time.
For Dip Soldering :
1 Pre-Heat Temp : 150 Max. 120 Sec. Max.
2 Bath Temp : 265 Max.
3 Dip Time : 5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
DRAWING NO. : DS-78-08-0003
PARA-FOR-068
DATE : 2008-02-21 PAGE 13 of 15