L-C170WDT Datasheet, PDF (13/15 Pages) PARA LIGHT ELECTRONICS CO., LTD. – SURFACE MOUNT DEVICE LED

SURFACE MOUNT DEVICE LED
Part No. : L-C170WDT
4. Lead-Free Soldering
For Reflow Soldering :
1 Pre-Heat Temp: 150-180 ,120sec.Max.
2 Soldering Temp: Temperature Of Soldering Pot Over 230 ,40sec.Max.
3 Peak Temperature: 260 5sec.
4 Reflow Repetition: 2 Times Max.
5 Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu
For Soldering Iron (Not Recommended) :
1 Iron Tip Temp: 350 Max.
2 Soldering Iron: 30w Max.
3 Soldering Time: 3 Sec. Max. One Time.
For Dip Soldering :
1 Pre-Heat Temp: 150 Max. 120 Sec. Max.
2 Bath Temp: 265 Max.
3 Dip Time: 5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
Release by
PARA LIGHT DCC
REV: A / 4
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
DRAWING NO. : DS-72-06-0024
PARA-FOR-068
DATE : 2011-05-25 PAGE 13 of 15