L-C170WDT Datasheet, PDF (12/15 Pages) PARA LIGHT ELECTRONICS CO., LTD. – SURFACE MOUNT DEVICE LED

Release by
PARA LIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-C170WDT
REV: A / 4
z CAUTIONS
1.Application Limitation :
The LED s described here are intended to be used for ordinary electronic equipment(such
as office equipment, communication equipment and household application).Consult PARA’s sales in
advance for information on application in which exceptional quality and reliability are required,
particularly when the failure or malfunction of the LED’s may directly jeopardize life or health (such
as airplanes, automobiles, traffic control equipment, life support system and safety devices).
2.Storage :
Before opening the package :
The LEDs should be store kept at 5°C to 30°C or less and 85%RH or less.
After opening the package :
The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered within 168
hours(7 days) after opening the package.
Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur.
LEDs stored out of their original packaging for more than a week should be baked at 30°C for at 24 hours before
solder assembly.
3.Soldering
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max.
performed consecutively cooling process is required between 1^st and 2^nd soldering processes.
DRAWING NO. : DS-72-06-0024
PARA-FOR-068
DATE : 2011-05-25 PAGE 12 of 15