EZJPZV6R8GANIL Datasheet, PDF (9/13 Pages) Panasonic Semiconductor – Multilayer Varistors

Multilayer Varistors
1.2 Operating Voltage
The Varistors shall not be operated in excess of the
“Maximum allowable voltage”. If the Varistors are
operated beyond the specified Maximum allowable
voltage, it may cause short and/or damage due to
thermal run away. When high frequency and steep
pulse voltages are continuously used, even when
less than the Maximum allowable voltage, in a
circuit, please examine the reliability of the Varistor
while also checking the safety and reliability of your
circuit. Check safety and reliability in your circuit.
1.3 Self-heating
The surface temperature of the Varistors shall be
under the specified Maximum Operating
Temperature in the Specifications including the
temperature rise cause by self-heating. Check
temperature rise of the Varistor in your circuit.
1.4 Environmental Restrictions
The Varistors shall not be operated and/or stored
under the following conditions.
(1) Environmental conditions
(a) Under direct exposure to water or salt water
(b) Under conditions where water can condense
and/or dew can form
(c) Under conditions containing corrosive gases
such as hydrogen sulfide, sulfurous acid,
chlorine and ammonia
(2) Mechanical conditions
Under severe conditions of vibration or impact
beyond the specified conditions found in the
Specifications.
2. Design of Printed Circuit Board
2.1 Selection of Printed Circuit Boards
When the Varistors are mounted and soldered on an
“Alumina Substrate”, the substrate influences the
Varistors’ reliability against “Temperature Cycles”
and “Heat shock” due to the difference in the
thermal expansion coefficient between them.
Confirm that the actual board used does not
deteriorate the characteristics of the Varistors.
2.2 Design of Land Pattern
(1) Recommended land dimensions are shown
below. Use the proper amount of solder in order to
prevent cracking. Using too much solder places
excessive stress on the Varistors.
Recommended Land Dimensions
Land SMD
ba
c
Solder resist
c
b
a
SMD
Land
Size Code
Componen^Pt
dimensions
LWT
S
(0504 2Array)
1.37
1.0
0.6
a
0.3～
0.4
b
0.45～
0.55
C
0.3～
0.4
P
0.54～
0.74
(2) The size of lands shall be designed to have equal
spacing between the right and left sides. If the
amount of solder on the right land is different from
that on the left land, the component may be
cracked by stress since the side with a larger
amount of solder solidifies later during cooling.
Recommended Amount of Solder
(a) Excessive amount (b) Proper amount (c) Insufficient amount
2.3 Utilization of Solder Resist
(1) Solder resist shall be utilized to equalize the
amounts of solder on both sides.
(2) Solder resist shall be used to divide the pattern for
the following cases;
ï½¥Components are arranged closely.
ï½¥The Varistor is mounted near a component with
lead wires.
ï½¥The Varistor is placed near a chassis.
See the table below.
Prohibited Applications and Recommended Applications
Item
Prohibited
applications
Improved applications
by pattern division
The lead wire of a
component with lead wires
Mixed mounting
Solder resist
with a component
with lead wires
Arrangement
near chassis
Retro-fitting of
component with
lead wires
Chassis
Solder
(Ground solder)
Solder resist
Electrode pattern
Soldering
iron
A lead wire of
Retro-fitted
Solder resist
component
Component dimensions
Size Code _{L W}
T
a
Z(0201) 0.6 0.3
0.3 0.2 to 0.3
0(0402) 1.0 0.5
0.5 0.4 to 0.5
1(0603) 1.6 0.8
0.8 0.8 to 1.0
2(0805) 2.0 1.25 0.8 to 1.25 0.8 to 1.2
b
0.2 to 0.3
0.4 to 0.5
0.6 to 0.8
0.8 to 1.0
c
0.2 to 0.3
0.4 to 0.5
0.6 to 0.8
0.8 to 1.0
Lateral
arrangement
Portion to be expressively
soldered
Land
2.4 Component Layout
Solder resist
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
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