EXC-14CE900U Datasheet, PDF (8/12 Pages) Panasonic Semiconductor – PRODUCT SPECIFICATION FOR APPROVAL

Classification
Specification
Product Name
Common Mode Noise Filter (Type EXC14CE)
No.
151-EXC-14CE202S
Page
7 of 11
10. Chip-mounting Considerations
10-1. Recommended Land Pattern (Only for Reflow Soldering)
B
E FE
D
A
C
D
A ^{0.80 to 1.00 (0.031 to 0.039)}
B ^{0.80 (0.031)}
C ^{0.30 (0.012)}
D ^{0.25 to 0.35 (0.010 to 0.014)}
E ^{0.30 (0.012)}
F ^{0.20 (0.008)}
Unit: mm (inch)
1) When this products are mounted on a PCB, the amount of solder used (size of fillet) can
directly affect this product performance.
2) The amount of solder applied can affect the ability of products to withstand mechanical
stresses which may lead to breaking or cracking.
Therefore, when designing land-patterns it is necessary to consider the appropriate size
and configuration of the solder pads which in turn determines the amount of solder
necessary to form the fillets.
10-2. Pattern Configurations
1) After this products have been mounted on the PC boards, products can be subjected to
mechanical stresses in subsequent manufacturing processes. For this reason, planning
pattern configurations and the position of SMD inductors should be carefully performed to
minimize stress.
2) Board separation should not be done manually, but by using the appropriate devices.
10-3. Considerations for Automatic Chip-Mounting
Excessive impact load should not be imposed on the inductors when mounting onto the PC
boards.
Constitution
July. 28, 2008
Circuit Components Business Unit
Panasonic Electronic Devices Co., Ltd.