EZA-CT31AAAJ Datasheet, PDF (7/9 Pages) Panasonic Semiconductor – Chip RC Networks

Chip RC Networks
■ Recommended Land Pattern Design
●EZACT
bg
P
●EZADT
c
h
Pb
●EZAST/SS
c
g
f2
c
GND
b
P
Land pattern
a
b
c
d
Dimensions
(mm)
0.75
0.25
1.70
0.35
e
h
g
P
Dimensions
(mm)
1.85
2.60
0.25
0.60
Land pattern
a
Dimensions
(mm)
0.9 to 1.1
b
0.2 to 0.3
c
2.6 to 2.8
d
0.3 to 0.4
f
Dimensions
(mm)
2.0 to 2.6
g
3.6 to 4.2
P
0.635
Solder resistant
Land pattern
a
b
c
d
Dimensions
(mm)
1.2 to 1.4
0.4
3.1 to 3.3 0.4 to 0.5
e
f1
f2
P
Dimensions
(mm)
0.8
2.9 to 3.3 4.8 to 5.2
0.8
●EZASTB/SSB
f2
GND
c db
P
Land pattern
a
b
c
d
Dimensions
(mm)
1.4 to 1.6
0.35
0.45
0.3
f1
f2
P
Dimensions
(mm)
2.7 to 3.5
3.8
0.65
●EZANT
b
P
Land pattern
a
Dimensions
(mm)
2.3 to 2.5
b
0.4 to 0.6
c
5.6 to 5.8
d
0.4 to 0.8
f
g
P
c
Dimensions
(mm)
4.3 to 4.7
7.6 to 8.0
1.27
g
• Design to make GND pattern as large as possible, because high
frequency noise is removed from GND terminals of chip RC network.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006