EZA-CT31AAAJ Datasheet, PDF (6/9 Pages) Panasonic Semiconductor – Chip RC Networks

■ Packaging Methods (Taping)
● Standard Quantity
Type
Kind of Taping
EZACT
EZADT
Punched Carrier Taping
EZAST/SS
EZASTB/SSB
Embossed Carrier Taping
EZANT
● Carrier Tape
fD0
Pitch (P1)
4 mm
P1
P2
P0
Chip RC Networks
Quantity
5000 pcs./reel
4000 pcs./reel
(Unit : mm)
T
T
A
fD1 (Only Emboss)
Type
EZACT
EZADT
EZAST/SS
EZASTB/SSB
EZANT
A
1.65^±0.15
2.00^±0.20
2.50^±0.20
3.50^±0.20
B
2.40^±0.20
3.60^±0.20
W
8.00^±0.20
F
3.50^±0.05
4.40^±0.20
6.80^±0.20
12.00^±0.30
5.50^±0.20
E
1.75^±0.10
1.75^±0.20
P1
4.00^±0.10
P2
2.00^±0.05
P0
4.00^±0.10
fD₀
1.50^+−00.10
T
0.85^±0.05
1.15^±0.20
1.30^±0.20
fD₁
—
1.50^+−00.10
● Taping Reel
T
fC
Type
EZACT
EZADT
EZAST/SS
EZASTB/SSB
EZANT
fA
fB
180.0^+–03.0 60 min.
fC
13.0^±1.0
(Unit : mm)
W
T
9.0^±1.0 11.4^±2.0
13.0^±1.0 15.4^±2.0
fA
W
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006