EYP2BN082 Datasheet, PDF (7/8 Pages) Panasonic Semiconductor – Thermal Cutoffs (TCO)

Thermal Cutoffs (TCO)
Bending
grasped ^Cutting
grasped
> 3 mm
> 3 mm
> 3 mm
> 3 mm
> 3 mm
> 3 mm
Fig-1
2. Soldering, Welding, Calking
1) Lead wires are to be soldered with the standard conditions shown in Table 1.
Excessive soldering heat and soldering time may cause damage to a TCO.
If higher temperature, longer time or shorter lead length exist rather than the conditions of Table 1 ,it is
recommended to run tests for finding the soldering conditions that do not damage the TCO. Also, use of
tools such as pliers are recommended to dissipate the soldering heat by grasping lead wires between the
TCO body and soldering point.
2) Avoid preheating and gradual cooling as much as possible. However if preheating and gradual cooling is
done, set the process conditions after confirming that the TCO is not affected by these procedures.
3) Do not use reflow soldering.
4) Thin type (MP, ML and MU series) is not to be soldered.
5) If water or solvent is used for cleaning flux after soldering, check and confirm the reliability of the agent.
6) Lead wires are to be clamped at least 3 mm away from the seals.
Improper connections may cause damage to the seals or other parts and may result in nuisance tripping of
the devices due to the generation of excessive heat at a faulty high resistance junction.
7) Set the conditions for welding and calking only after checking contact resistance and connection strength.
8) When resoldering or rewelding, cool the TCO under room conditions.
9) When the TCO is heated by soldering or welding, be careful not to pull, push or twist the TCO lead wires.
Lead Length (k)
30 mm
Table-1 Soldering Conditions
Temperature of Soldering: 300 °C Time: 3 s
Type No.
F101
E101
H101
25 mm
N082, N099
E115, E134, E138 H115, H134, H138
20 mm
15 mm
N109, N110
N127, N134, N143
F115, F134,
F138, F145
E145
H145
● Soldering point
l
l
3. The use of sufficiently flexible, appropriate free length and proper size wire should be used for splice connection.
Connection including connectors used for splicing shall be of the low resistance type, and they shall be made
mechanically secure.
4. Where the lead wires of the TCO is tied with string, put them at least 10 mm apart from the seals of the main
body of the TCO.
5. Quality control notes.
1) Measurement of resistance between lead wires (terminals) and checking of the internal status with X-rays are
effective means to confirm the status of the TCO on delivery and after mounting in the equipment.
6. Storage method
1) Store the TCO in packing cases or in polyethylene bags within the temperature range -10 °C to +40 °C and
RH of 30 % to 75 %. Store them at a location where no rapid changes of temperature or humidity or no
direct sunlight is applied. The location must also be free from vibration and shock .
2) Avoid storage in places containing corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2 and NO2.
3) The period of guarantee for performance such as solderability is for one year after our delivery; and this
condition applies only in the case where the storage method specified in above has been followed.
7. Do not repair a TCO. Replace it with a new part.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jul. 2008