EXBV8V472JV_1 Datasheet, PDF (5/5 Pages) Panasonic Semiconductor – Chip Resistor Array

Chip Resistor Array
Cautions for Safety
1. Component Placement
A Take measure against mechanical stress during and after mounting so as not to damage the termination
and protective coating.
B Misplacement of components on the land pattern may cause solder bridge problem.
2. Soldering
Precaution and recommondations are described
below.
(a)Soldering iron
Keep the followings:
A Soldering iron tip shall not touch the protective
coating of the part.
B Solder as quick as possible (within 3 seconds)
when the temperature of the soldering iron tip is
over 280 ¡C.
(b)Reflow soldering
Recommendable reflow soldering is shown right.
3. Cleaning
Recommendable cleaning method is shown below.
Solvents
Isopropyl
Alcohol
Cleaning condition
Dipping Ultrasonic wave washing
[ ] ^{5 minutes 1 minute maxium}
maximum ^{Power: 20 W/L}
Frequency: 10 kHz to 100 kHz
4. If transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and
confirmation test with the resistors actually mounted on your own board.
When the load of more than rated power is applied under the load condition at steady state, it may impair
performance and/or reliability of resistor. Never exceed the rated power.
5. Chlorine type or other high-activity flux is not recommeded as the residue may affect performance or reliability
of resistors.
6. When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron.
When using a soldering iron with a tip at high temperature, solder for a time as short as possible (three
seconds or less up to 350 ¡C).
7. Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as
it may damage protective film or the body of resistor and may affect resistorÕs performance.
8. Do not use the product in dewy atmospheres.