AMG8831 Datasheet, PDF (4/6 Pages) Panasonic Semiconductor – Infrared Array Sensor Grid-EYE

Infrared Array Sensor Grid-EYE (AMG88)
RECOMMENDED EXTERNAL CIRCUIT
1. In case of setting I²C slave address of the sensor 1101000
* Connect terminal T (AD_SELECT) to GND.
2. In case of setting I²C slave address of the sensor 1101001
* Connect terminal T (AD_SELECT) to VDD.
VDD
VDD
To microcomputer etc.
To microcomputer etc.
To microcomputer etc.
10kΩ 10kΩ 10kΩ
WSDA
ESCL
RINT
TAD_SELECT
YGND
qVPP
}DVDD-PC
PAVDD-PC
OVDD
10kΩ 10kΩ 10kΩ 10kΩ
To microcomputer etc.
To microcomputer etc.
To microcomputer etc.
WSDA
ESCL
RINT
TAD_SELECT
YGND
qVPP
}DVDD-PC
PAVDD-PC
OVDD
GND
10µF
1µF _1.5µF
20Ω
GND
10µF
1µF _1.5µF
20Ω
Recommended external circuit
This circuit is an example to drive infrared array sensor “Grid-EYE”, so that we will not take any responsibility of loss which
is due to this circuit.
PACKING FORMAT (Tape and reel) (mm inch)
Tape dimensions
16.0^±0.3
.630^±.012
7.5^±0.1
.295^±.004
1.75^±0.1
.069^±.004
1.5
+0.1
−0
dia.
.059^+−.0004 dia.
0.35^±0.05
.014^±0.05
2.0^±0.5
.079^±.020
12.6^±0.1
.496^±.004
9.0^±0.1
.354^±.004
4.0^±0.1
.157^±.004
16.0^±0.1
.630^±.004
1.5
+0.1
0
dia.
.059^+.0004 dia.
2.0^±0.1
.079^±.004
4.7^±0.1
.185^±.004
Dimensions of tape reel
21.0^±0.8
.827^±0.8
17.5^±1.0
.689^±1.0
21.5^±3.0
.846^±3.0
Top cover tape
Embossed carrier tape
13^±0.5 dia.
.512^±.020 dia.
380.0^±2 dia.
14.961^±.079 dia.
100.0^±2 dia.
3.937^±.079 dia.
NOTES
1. Checkpoints relating to principle of
operation
The Infrared array sensor is a thermobile-
typed infrared sensor which detects
quantity of infrared ray. Generally,
temperature accuracy will be degraded in
the following situations. Be sure to verify
performance and reliability under actual
conditions of use and make any
necessary temperature corrections.
• There is a heat emitting body located
close to where the sensor is mounted.
• A flow of warm or cold air is hitting the
sensor.
• The temperature of the sensor is subject
to sudden changes.
• When an object made of glass, acrylic
or other subject which far infrared rays
have difficult passing through is located
between the sensor and what is to be
detected.
• A substance (dirt or water droplets) that
makes it difficult for far infrared rays to
pass through is attached to the sensor
lens.
2. Ambient operating conditions
1) Temperature: Please refer to
“RATING”.
2) Humidity: 15% to 85% R.H. (No
freezing nor condensation at low
temperature)
3) Atmospheric pressure: 86 to 106 kPa
4) Protect the sensor from impact and
vibration, because these can cause
damage that leads to malfunction and
degraded performance. And avoid
applying a load or impact since this will
deform or scratch the lens, making
proper operation impossible and causing
a deterioration in its performance.
5) The sensors do not have a water-proof
or dust-proof construction. Depending on
the ambient operating conditions, some
means of providing protection from water
and dust and preventing the formation of
ice and condensation must be provided
prior to using the sensors.
If condensation occurs, heat source
detection response may become delayed
by several seconds.
6) Please avoid using or storing the
infrared array sensor in a place exposed
to corrosive gases (such as the gases
given off by organic solvents, sulfurous
acid gas, hydrogen sulfides, etc.) which
will adversely affect the performance of
the infrared array sensor.
7) Since the internal circuitry may be
destroyed if an external surge voltages is
supplied, provide an element which will
absorb the surges.
8) Malfunctioning may occur if the
product is in the vicinity of electrical noise
such as that from static electricity,
lightning, a mobile phone, an amateur
radio and a broadcasting station.
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
ASCTB22E 201201-T