EZA-EG1A50AC Datasheet, PDF (3/6 Pages) Panasonic Semiconductor – ESD Suppressor

● Carrier Taping
Pressed Carrier Punched Carrier
ESD Suppressor
(Unit : mm)
P1
P2
P0
φD0
T
T
A
P1 ₍₂ mm Pitch)
Type
EZAEG1A
EZAEG2A
EZAEG3A
A
0.38^±0.05
0.70^±0.05
1.10^±0.10
B
0.68^±0.05
1.20^±0.05
1.90^±0.10
W
8.00^±0.20
F
3.50^±0.05
E
1.75^±0.10
P1
2.00^±0.10
4.00^±0.10
P2
2.00^±0.05
P0
4.00^±0.10
φD0
1.50^+–00.10
T
0.42^±0.05
0.60^±0.05
0.70^±0.05
● Taping Reel
T
φC
Type
EZAEG1A
EZAEG2A
EZAEG3A
(Unit : mm)
φA
φB
φC
W
T
180.0^+–03.0 60 min. 13.0^±1.0 9.0^±1.0 11.4^±1.0
φA
W
■ Recommended Land Pattern
In case of flow soldering, the land width must be smaller than the ESD Suppressor width to properly control the
solder amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of ESD Suppressor. In
case of reflow soldering, solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times
ESD Suppressor width (W).
ESD Suppressor
a
b
Type
(inches)
EZAEG1A
(0201)
EZAEG2A
(0402)
EZAEG3A
(0603)
Dimensions (mm)
a
b
c
0.3 to 0.4 0.8 to 0.9 0.25 to 0.35
0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
0.7 to 0.9 2.0 to 2.2 0.8 to 1.0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2009