DB2460100L Datasheet, PDF (3/5 Pages) Panasonic Semiconductor – Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)

Doc No. TT4-EA-13068
Revision. 2
Product Standards
Schottky Barrier Diode
DB2460100L
Technical Data ( reference )
1.E+01
1.E+00
1.E-01
1.E-02
IF - VF
Ta = 125 °C
85 °C
25 °C
1.E-03
1.E-04
-40 °C
1.E-05
0.0 0.1 0.2 0.3 0.4 0.5 0.6
Forward voltage VF (V)
1.E-01
1.E-02
1.E-03
1.E-04
1.E-05
1.E-06
1.E-07
1.E-08
1.E-09
0
IR - VR
Ta = 125 °C
85 °C
25 °C
-40 °C
10
20
30
40
50
60
Reverse voltage VR (V)
450
400
350
300
250
200
150
100
50
0
0
Ct - VR
Ta = 25 °C
f = 1 MHz
5 10 15 20 25 30 35 40
Reverse voltage VR (V)
1000
Rth - t
(1)
(2)
100
(3)
Rth(j-l) = 9 °C/W
10
1
0.001 0.01
(1) Non-heat sink
(2) Mounted on glass epoxy print board.
(3) Mounted on alumina print board.
Board size : 50 mm × 50 mm x 0.8 mm
Solder in : 2 mm x 2 mm
0.1
1
10
Time t (s)
100 1000
3.5
tp/T
3
DC
2.5 _1/2
2
IF(AV) - Tl
IF
tp
T
VR = 30 V
Tj = 125 °C
1.5
1/4
1
Sine Wave
0.5
0
0 25 50 75 100 125 150 175
Lead temperature Tl (°C)
PF(AV) - IF(AV)
2
IF
tp
1.5
T
DC
Sine Wave
1/2
1/4
1
0.5
0
0 0.5 1 1.5 2 2.5 3 3.5
Forward current (Average) IF(AV) (A)
Page 3 of 4
Established : 2011-03-09
Revised : 2013-04-20