EZANPE101M Datasheet, PDF (1/5 Pages) Panasonic Semiconductor – Chip Capacitor Networks

Chip Capacitor Networks
Type: _EZANP
GND
GND
Chip Capacitor Networks
■ Features
● Chip Capacitor Networks, exclusively developed by Panasonic using thick film technology.
8 capacitors bussed in one package (6.4 mm ҂ 3.1 mm ҂ 0.75 mm, 1.27 mm pitch), halfpitch (0.635 mm) spacing
for high density automatic placing
● Excellent noise reduction by connecting both ground terminals and a simple layout pattern (less through hole)
● Excellent mountability using concave terminals, firm solder joint (2 times that of convex terminal), self-aligning placement
during reflow soldering
<Effect of high density placing, PWB space saving>
I/O
I/O
Conventional Chip Capacitors
No Through Hole
I/O
I/O
0.635 mm
Chip Capacitor Network EZANP
■ Recommended Applications
● Digital equipment such as PCs, word processors, printers, HDD, PPC, and PDAs
● Digital audio and video equipment such as CD, MD, DAT, digital cameras, digital video and digital TV
● Communication equipment, cordless phones, automobile phones, GSM, PHS, DECT
● Electronic musical instruments, and other digital devices
■ Explanation of Part Numbers
1
2
3
4
5
E Z ANP
6
7
8
9
10
11
E
1 0 1M
Product Code
Dimensions and
Circuit Configuration
Temperature
Characteristics
Capacitance Value Capacitance Suffix for Special
Tolerance
Requirement
Thick Film Noise
Suppression and
Filtering Components
8 Capacitors,
NP
6.4 mm _Common
҂3.1 mm _{terminal type}
E
+20 %/–55 %
(–25 °C to +85 °C)
The first two digits are
significant figures of
capacitance value, and
the third one denotes the
number of zeroes fellow.
ex. 101ৎ100 pF
±20 %
M
+30 %
–20 %
in
the
case
of
22
pF
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006