Q65110A2173 Datasheet, PDF (11/15 Pages) OSRAM GmbH – Lead (Pb) Free Product - RoHS Compliant

LS T670, LO T670, LY T670, LG T670, LP T670
Lötbedingungen
Soldering Conditions
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
IR-Reflow Lötprofil für bleifreies Löten
(nach J-STD-020B)
IR Reflow Soldering Profile for lead free soldering (acc. to J-STD-020B)
300
˚C
T ²⁵⁰
200
255 ˚C
240 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
OHLA0687
260
˚C
+0 ˚C
-5 ˚C
245 ˚C ^{±5 ˚C}
235
˚C
+5 ˚C
-0 ˚C
10 s min
30 s max
150
100
50
0
0
Ramp Up
3 K/s (max)
25 ˚C
50
Wellenlöten (TTW)
TTW Soldering
120 s max
Ramp Down
6 K/s (max)
100 s max
min. condition for IR Reflow Soldering:
solder point temperature ≥ 235 °C for at least 10 sec.
100
150
200
250
s 300
t
(nach CECC 00802)
(acc. to CECC 00802)
300
C
10 s
T 250
200
150
100
50
235 C ... 260 C
1. Welle
1. wave
ca 200 K/s
100 C ... 130 C
2. Welle
2. wave
5 K/s
2 K/s
Zwangskühlung
2 K/s _{forced cooling}
OHLY0598
Normalkurve
standard curve
Grenzkurven
limit curves
0
0
50
100
150
200
s 250
t
2006-01-01
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