LOV196 Datasheet, PDF (10/14 Pages) OSRAM GmbH – Lead (Pb) Free Product - RoHS Compliant

Empfohlenes Lötpaddesign^{8) Seite 14}
Recommended Solder Pad^{8) page 14}
LG V196, LO V196, LS V196, LY V196
IR Reflow Löten
IR Reflow Soldering
Component location
on pad
1
1
2.8
OHPY1303
Lötbedingungen
Soldering Conditions
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
IR-Reflow Lötprofil für bleifreies Löten
(nach J-STD-020B)
IR Reflow Soldering Profile for lead free soldering (acc. to J-STD-020B)
300
˚C
T ²⁵⁰
200
255 ˚C
240 ˚C
217 ˚C
150
100
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
OHLA0687
260
˚C
+0 ˚C
-5 ˚C
245 ˚C ^{±5 ˚C}
235
˚C
+5 ˚C
-0 ˚C
10 s min
30 s max
120 s max
Ramp Down
6 K/s (max)
100 s max
Ramp Up
50
3 K/s (max)
25 ˚C
0
0
50
100
150
200
250
s 300
t
2008-12-15
10