OSXX0402C1C_VER.A.1 Datasheet, PDF (6/7 Pages) OptoSupply International – 1.0x0.5x0.4mm smd

1.0 x 0.5 x 0.4mm SMD
■ Taping and Orientation.
1. Quantity: 4,000 units/reel
2. Diameter: 178 mm
OSXX0402C1C
Ver.a.1
3. General Tolerance : ± 0.1
■ Cautions:
1. After open the package, the LED should be kept at 30°C, 30%RH or less. The LED should
be soldered within 24 hours (1 day) after opening the package.
2. Heat generation must be taken into design consideration when using the LED.
3. Power must be applied resistors for protection, over current would be caused the optic
damage to the devices and wavelength shift.
4. Manual tip solder may cause the damage to Chip devices, so advised that heat of iron
should be lower than 15W with temperature control under 5 seconds at 230-260 deg. C.
( The device would be got damage in re working process, recommended under 5 seconds
at 230-260 deg. C)
5. All equipment and machinery must be properly grounded. It is recommended to use a
wristband or anti-electrostatic glove when handing the LED.
6. Use IPA as a solvent for cleaning the LED. The other solvent may dissolve the LED
package and the epoxy, Ultrasonic cleaning should not be done.
7. Damaged LED will show unusual characteristics such as leak current remarkably increase,
turn-on voltage becomes lower and the LED get unlight at low current.
LED & Application Technologies