CM1230 Datasheet, PDF (9/16 Pages) California Micro Devices Corp – 2, 4 and 8-Channel Low Capacitance ESD Protection Array

CM1230
Mechanical Details
CSP-4 Mechanical Specifications (CM1230-02CP)
The CM1230-02CP is supplied in a 4 bump Chip Scale Package (CSP). Dimensions are shown below. For
complete information on the CSP, see the California Micro Devices CSP Package Information document.
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
4
Millimeters
Dim
Inches
Min Nom Max Min Nom Max
A1 ^{0.915 0.960 1.005 0.0360 0.0378 0.0396}
A2 ^{0.915 0.960 1.005 0.0360 0.0378 0.0396}
B1 ^{0.495 0.500 0.505 0.0195 0.0197 0.0199}
B2 ^{0.495 0.500 0.505 0.0195 0.0197 0.0199}
C1 ^{0.180 0.230 0.280 0.0071 0.0091 0.0110}
C2 ^{0.180 0.230 0.280 0.0071 0.0091 0.0110}
D1 ^{0.575 0.644 0.714 0.0226 0.0254 0.0281}
D2 ^{0.368 0.419 0.470 0.0145 0.0165 0.0185}
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Package Dimensions for
CM1230-02CP Chip Scale Package
Rev. 3 | Page 9 of 16 | www.onsemi.com