CM1230 Datasheet, PDF (8/16 Pages) California Micro Devices Corp – 2, 4 and 8-Channel Low Capacitance ESD Protection Array

CM1230
Application Information
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
VALUE
0.240mm
Round
Non-Solder Mask defined pads
0.290mm Round
0.125mm - 0.150mm
0.300mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50μm
+20μm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev.3 | Page 8 of 16 | www.onsemi.com