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MC10EP131 Datasheet, PDF (8/10 Pages) ON Semiconductor – 3.3V / 5V ECL Quad D Flip-Flop with Set, Reset, and Differential Clock | |||
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MC10EP131, MC100EP131
A
A1
32
PACKAGE DIMENSIONS
LQFP
FA SUFFIX
32âLEAD PLASTIC PACKAGE
CASE 873Aâ02
ISSUE A
4X
0.20 (0.008) AB TâU Z
25
1
âTâ
B
B1
8
9
DETAIL Y
âUâ
V
17 V1
9
âZâ
4X
S1
0.20 (0.008) AC TâU Z
S
âABâ
SEATING
PLANE
âACâ
G
0.10 (0.004) AC
8X M_
R
CE
DETAIL AD
BASE
METAL
FÃÃÃNÃÃÃ D
J
SECTION AEâAE
W
H
K Q_
X
DETAIL AD
AE
P
AE
DETAIL Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE âABâ IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS âTâ, âUâ, AND âZâ TO BE DETERMINED
AT DATUM PLANE âABâ.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE âACâ.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE âABâ.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
MILLIMETERS
DIM MIN MAX
A 7.000 BSC
A1 3.500 BSC
B 7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.300 0.450
E 1.350 1.450
F 0.300 0.400
G 0.800 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
M
12_ REF
N 0.090 0.160
P 0.400 BSC
Q
1_
5_
R 0.150 0.250
S 9.000 BSC
S1 4.500 BSC
V 9.000 BSC
V1 4.500 BSC
W 0.200 REF
X 1.000 REF
INCHES
MIN MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055 0.063
0.012 0.018
0.053 0.057
0.012 0.016
0.031 BSC
0.002 0.006
0.004 0.008
0.020 0.028
12_ REF
0.004 0.006
0.016 BSC
1_
5_
0.006 0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
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