CSPEMI202AG Datasheet, PDF (8/9 Pages) ON Semiconductor – 2 Channel Headset Microphone EMI Filter with ESD Protection

CSPEMI202AG
Mechanical Details
CSP Mechanical Specifications
The CSPEMI202AG is available in a custom Chip Scale Package (CSP). Dimensions are presented below. For
complete information on CMD’s Chip Scale Packaging, see the California Micro Devices CSP Package
Information document.
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
5
Millimeters
Dim
Inches
Min Nom Max Min Nom Max
A1 ^{0.885 0.930 0.975 0.0348 0.0366 0.0384}
A2 ^{1.365 1.410 1.455 0.0537 0.0555 0.0573}
B1 ^{0.495 0.500 0.505 0.0195 0.0197 0.0199}
B2 ^{0.245 0.250 0.255 0.0096 0.0098 0.0100}
B3 ^{0.430 0.435 0.440 0.0169 0.0171 0.0173}
B4 ^{0.430 0.435 0.440 0.0169 0.0171 0.0173}
C1 ^{0.165 0.215 0.265 0.0065 0.0085 0.0104}
C2 ^{0.220 0.270 0.320 0.0087 0.0106 0.0126}
D1 ^{0.562 0.606 0.650 0.0221 0.0239 0.0256}
D2 ^{0.356 0.381 0.406 0.0140 0.0150 0.0160}
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
BOTTOM VIEW
A1
C1
B2
B1
SIDE
VIEW
C
B
A
123
0.30 DIA.
D1
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) ^D2
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPEMI202AG Chip Scale Package
Rev. 3 | Page 8 of 9 | www.onsemi.com