MC74LVX541 Datasheet, PDF (7/8 Pages) ON Semiconductor – Octal Bus Buffer

20
1
Z
D
e
b
0.13 (0.005) M
MC74LVX541
PACKAGE DIMENSIONS
SOIC EIAJ–20
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967–01
ISSUE O
11
E H_E
10
A
L_E
Q₁
M_
L
DETAIL P
VIEW P
c
A₁
0.10 (0.004)
NOTES:
ąă1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
ąă2. CONTROLLING DIMENSION: MILLIMETER.
ąă3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
ąă4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
ąă5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
DIM MIN MAX
A
--- 2.05
A_{1 0.05 0.20}
b 0.35 0.50
c 0.18 0.27
D 12.35 12.80
E 5.10 5.45
e
1.27 BSC
H_E 7.40 8.20
L 0.50 0.85
L_E 1.10 1.50
M
0 _ 10 _{_}
Q₁ 0.70 0.90
Z
--- 0.81
INCHES
MIN MAX
--- 0.081
0.002 0.008
0.014 0.020
0.007 0.011
0.486 0.504
0.201 0.215
0.050 BSC
0.291 0.323
0.020 0.033
0.043 0.059
0 _ 10 _{_}
0.028 0.035
--- 0.032
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