CAT3636 Datasheet, PDF (7/14 Pages) Catalyst Semiconductor – 6-Channel Quad-ModeTM Fractional LED Driver in TQFN3x3

CAT3636
Table 5. PIN DESCRIPTION
Pin #
Name
Function
1
LEDC2
LEDC2 cathode terminal
2
LEDC1
LEDC1 cathode terminal
3
LEDB2
LEDB2 cathode terminal
4
LEDB1
LEDB1 cathode terminal
5
LEDA2
LEDA2 cathode terminal
6
LEDA1
LEDA1 cathode terminal
7
VOUT
Charge pump output, connect to LED anodes
8
VIN
Charge pump input, connect to battery or supply
9
C1+
Bucket capacitor 1, positive terminal
10
C1−
Bucket capacitor 1, negative terminal
11
C2+
Bucket capacitor 2, positive terminal
12
C2−
Bucket capacitor 2, negative terminal
13/14
NC
No connect
15
GND
Ground reference
16
EN/SET
Device enable (active high) and 1 wire control input
TAB
TAB
Connect to GND on the PCB
Pin Function
VIN is the supply pin for the charge pump. A small 1 mF
ceramic bypass capacitor is required between the VIN pin
and ground near the device. The operating input voltage
range is from 2.5 V to 5.5 V. Whenever the input supply falls
below the under−voltage threshold (2 V) all the LED
channels will be automatically disabled and the device
register are reset to default values.
EN/SET is the enable and one wire addressable control logic
input for all LED channels. Guaranteed levels of logic high
and logic low are set at 1.3 V and 0.4 V respectively. When
EN/SET is initially taken high, the device becomes enabled
and all LED currents remain at 0 mA. To place the device
into zero current mode, the EN/SET pin must be held low for
more than 1.5 ms.
VOUT is the charge pump output that is connected to the
LED anodes. A small 1 mF ceramic bypass capacitor is
required between the VOUT pin and ground near the device.
GND is the ground reference for the charge pump. The pin
must be connected to the ground plane on the PCB.
C1+, C1− are connected to each side of the ceramic bucket
capacitor C1.
C2+, C2− are connected to each side of the ceramic bucket
capacitor C2.
LEDxx provide the internal regulated current for each of the
LED cathodes. These pins enter high−impedance zero
current state whenever the device is placed in shutdown
mode.
TAB is the exposed pad underneath the package. For best
thermal performance, the tab should be soldered to the PCB
and connected to the ground plane.
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