AND8002 Datasheet, PDF (7/16 Pages) ON Semiconductor – ECLinPS, ECLinPS Lite, ECLinPS Plus ECLinPS MAX, and GigaComm Marking and Ordering Information Guide

AND8002/D
Package Suffix
The package suffixes are shown in the data sheet Marking Diagram. The package suffixes for all ECLinPS families and the
GigaComm family are listed in the following table.
Table 7. ECLinPS and GigaComm Package Suffixes
Suffix
Package
Pins
BA
FCBGA−16
16
D
SO−8
8
D
SO−16
16
DT
TSSOP−8
8
DT
TSSOP−16
16
DT
TSSOP−20
20
DW
SO−20
20
FA
LQFP−32
32
FA
LQFP−52
52
FA
LQFP−52
52
FA
LQFP−64
64
FN
PLCC−20
20
FN
PLCC−28
28
L
CDIP−16
16
M
EIAJ SO−14
14
MN
QFN−24
24
L
CDIP−16
16
P
PDIP−16
16
Case
489
751
751B
948R
948F
948E
751D
873A
848−D
848H
848G
775
776
620
965
485L
620
648
Description
Ball Grid Array
Small Outline IC
Small Outline IC
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Small Outline IC
Leaded Quad Flat Pack
Leaded Quad Flat Pack
Leaded Quad Flat Pack
Leaded Quad Flat Pack
Plastic Leaded Chip Carrier
Plastic Leaded Chip Carrier
Ceramic DIP
EIAJ Small Outline IC
Quad Flat No−Lead
Ceramic DIP
Plastic DIP
Shipping Specification
The “Shipping” column in the Ordering Information table specifies the shipping configuration that corresponds to the device
order number. Add R2 to the regular package suffix to order tape and reel shipping configurations. Refer to Brochure
BRD8011/D for further tape and reel information.
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