AND8002 Datasheet, PDF(2/16 Page) ON Semiconductor – ECLinPS, ECLinPS Lite, ECLinPS Plus ECLinPS MAX, and GigaComm Marking and Ordering Information Guide

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AND8002 Datasheet, PDF (2/16 Pages) ON Semiconductor – ECLinPS, ECLinPS Lite, ECLinPS Plus ECLinPS MAX, and GigaComm Marking and Ordering Information Guide

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AND8002/D

SECTION 1: Data Sheet Marking Diagrams

Device Marking Examples

The marking format is dependent upon the device

package, and larger device packages allow the inclusion of

more information on the face of the device. A marking

example for the large 52âpin NB100LVEP222 is shown

below. Note that the device marking includes the following

coded information that is described in later sections:

Code 1

Circuit

Identification

Code

â¢ Code 1. Circuit Identification Code

â¢ Code 2. Temperature Compensation Code

â¢ Code 3. Family Identification Code

â¢ Code 4. Function Type Code

â¢ Code 5. Assembly Location Traceability Code

â¢ Code 6. Wafer Lot Traceability Code

â¢ Code 7. Year Date Code

â¢ Code 8. Work Week Date Code

Code 2

Temperature

Compensation

Code

Code 3

Family Identification

Code

Code 5

Assembly Location

Traceability Code

NB100

LVEP 222

A WL YY WW

Code 4

Function Type

Code

Code 8

Work Week

Date Code

Code 6

Wafer Lot

Traceability Code

Code 7

Year

Date Code

Figure 1. 52âPin Marking Example

A marking example for the 8âpin TSSOP MC100EP16

device is shown in Figure 2. Note that the 8âpin package

does not allow for as much marking information as the

52âpin package.

Code 3

Family Identification

Code

Code 2

Temperature

Compensation

Code

K P 16

Code 4

Function Type

Code

ALYW

Code 5

Assembly Location

Traceability Code

Code 6

Wafer Lot 1

Traceability Code

Code 8

Work Week

Date Code

Code 7

Year

Date Code

Figure 2. 8âPin Marking Example

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