CM1235_14 Datasheet, PDF (6/9 Pages) ON Semiconductor – Small Footprint ESD Clamp Array for High Speed Data Line Protection

CM1235
Performance Information
Graphical Comparison and Test Setup
Figure 5 shows that the CM1235 (ESD protector) lowers the peak voltage and clamping voltage by 45% across a wide range
of loading conditions in comparison to a standard ESD protection device. Figure 6 also indicates that the DUP/ASIC protected
by the CM1235 dissipates less energy than a standard ESD protection device. This data was derived using the test setups shown
in Figure 7.
1.2
STD ESD Device
1.0
0.8
CM1235
0.6
0.4
0.2
0.5
0.4
STD ESD Device
0.3
CM1235
0.2
0.1
0
5
10
20
RDUP (W)
Figure 5. Normalized VPeak (8 KV IEC−61000
4−2 ESD Contract Strike) vs. Loading (RDUP)*
0
5
10
20
RDUP (W)
Figure 6. Normalized Residual Current into
DUP vs. RDUP*
*RDUP is the emulated Dynamic Resistance (load) of the Device Under Protection (DUP).
IEC 61000−4−2
Test Standards
Standard
ESD Device
Standard ESD
Device Test Setup
Voltage
Probe
Device Under
Protection (DUP)
R_VARIABLE
Current
Probe
I_RESIDUAL
IEC 61000−4−2
Test Standards
CM1235
CM1235 Test Setup
Voltage
Probe
Device Under
Protection (DUP)
R_VARIABLE
Current
Probe
I_RESIDUAL
Figure 7. Test Setups: Standard Device (Left) and CM1235 (Right)
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