NRVUB1620CTRT4G Datasheet, PDF (5/6 Pages) ON Semiconductor – SWITCHMODE Power Rectifier

MUR1620CTRG, MURB1620CTRG, NRVUB1620CTRT4G
PACKAGE DIMENSIONS
L1
H
e
NOTE 6
E
E2
TOP VIEW
D²PAK−3 (TO−263, 3−LEAD)
CASE 418AJ
ISSUE A
A
A
NOTE 3
B
SEATING
PLANE
c2
A
D1
D
DETAIL C
L1
E1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. CHAMFER OPTIONAL
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH. MOLD FLASH SHALL NOT EXCEED 0.005
PER SIDE. THESE DIMENSIONS ARE MEASURED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY AT DATUM H.
5. THERMAL PAD CONTOUR IS OPTIONAL WITHIN
DIMENSIONS E, L1, D1 AND E1.
6. OPTIONAL MOLD FEATURE
L2
A
c
2X b
SIDE VIEW
0.10 M B A M
0.10 M B A M
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.160 0.190 4.06 4.83
A1 0.000 0.010 0.00 0.25
VIEW A−A
b 0.020 0.039 0.51 0.99
c 0.012 0.029 0.30 0.74
c2 0.045 0.065 1.14 1.65
GAUGE
H
D 0.330 0.380 8.38 9.65
D1 0.260 −−−− 6.60 −−−−
PLANE
E 0.380 0.420 9.65 10.67
L3
E1 0.245 −−−− 6.22 −−−−
e 0.100 BSC
2.54 BSC
H 0.575 0.625 14.60 15.88
L 0.070 0.110 1.78 2.79
L1 −−−− 0.066 −−−− 1.68
M
L
A1
DETAIL C
B
SEATING
PLANE
L2 −−−− 0.070 −−−− 1.78
L3 0.010 BSC
0.25 BSC
M 0°
8°
0°
8°
VIEW A−A
OPTIONAL CONSTRUCTIONS
RECOMMENDED
SOLDERING FOOTPRINT*
0.436
0.653
0.366
2X
0.169
2X
0.063
0.100
PITCH
DIMENSIONS: INCHES
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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