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NCP1218 Datasheet, PDF (5/20 Pages) ON Semiconductor – PWM Controller with Adjustable Skip Level and External Latch Input
NCP1218
Table 2. MAXIMUM RATINGS (Notes 1 − 4)
Rating
Symbol
Value
Unit
HV Voltage
HV Current
Supply Voltage
Supply Current
Skip/latch Voltage
Skip/latch Current
FB Voltage
FB Current
CS Voltage
CS Current
DRV Voltage
DRV Current
Operating Junction Temperature
Storage Temperature Range
Power Dissipation (TA = 25°C, 2.0 Oz Cu, 1.0 Sq Inch Printed Circuit Copper Clad)
D Suffix, Plastic Package Case 751U (SOIC−7) (Note 4)
VHV
IHV
VCC
ICC
VSkip/latch
ISkip/latch
VFB
IFB
VCS
ICS
VDRV
IDRV
TJ
Tstg
PD
−0.3 to 500
V
100
mA
−0.3 to 20
V
100
mA
−0.3 to 9.5
V
100
mA
−0.3 to 5.0
V
100
mA
−0.3 to 5.0
V
100
mA
−0.3 to 20
V
−500 to 800 mA
–40 to 150
°C
–60 to 150
°C
W
0.92
Thermal Resistance, Junction to Ambient (2.0 Oz Cu Printed Circuit Copper Clad)
°C/W
D Suffix, Plastic Package Case 751U (SOIC−7)
Junction to Air, Low conductivity PCB (Note 3)
Junction to Lead, Low conductivity PCB (Note 3)
Junction to Air, High conductivity PCB (Note 4)
Junction to Lead, High conductivity PCB (Note 4)
RθJA
177
RθJL
75
RθJA
136
RθJL
69
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Pins 1– 6: Human Body Model 3000 V per JEDEC JESD22−A114−F.
Pins 1– 6: Machine Model Method 300 V per JEDEC JESD22−A115−A.
Pin 8 is the HV startup of the device and is rated to the maximum rating of the part, or 500 V.
2. This device contains Latch−Up protection and exceeds ±100 mA per JEDEC Standard JESD78.
3. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 80 mm2 of 2 oz copper traces and heat spreading area. As specified for
a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection or zero air flow.
4. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 650 mm2 of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection or zero air flow.
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